China AI Chip Startup Uses 3D Stacking to Beat US Curbs

A Chinese artificial intelligence chip startup led by industry veteran Wei Shaojun has come out of stealth mode. The company, Dongfang Suanxin, is betting on a technology called 3D stacking to bypass US export controls. Wei is also vice-president of the China Semiconductor Industry Association. His startup has launched a corporate website and social media account, positioning itself as a new player in China’s AI computing sector. The move puts Dongfang Suanxin alongside giants like Huawei Technologies, which also uses 3D stacking to overcome restrictions on advanced chip imports. 3D stacking involves layering chips vertically to boost performance without relying on the latest manufacturing processes.